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Application Engineer - Bonder & Imaging Solutions (Travel)

SUSS

singapore, singapore, Singapore Full-time June 09, 2026
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Vacancy Description

SUSS in Singapore is seeking an Application Engineer for Bonder. The role involves providing application support on SUSS MicroTec tools, project execution, and recipe optimization. The ideal candidate should have a degree in Engineering/Science and a minimum of 5 years of experience in Lithography wafer process engineering. Candidates must possess excellent problem-solving abilities, communication skills, and a self-driven attitude. Benefits include year-end bonuses and support for exams and events.
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