Application Engineer: Bonder & Imaging Solutions

SÜSS MicroTec AG in Singapore seeks an experienced professional to provide application support for bonder tools, ensuring project success through efficient execution and recipe optimization. The role requires a degree in Engineering/Science and at least 5 years experience in Lithography wafer process engineering.

The successful candidate will develop innovative solutions to meet customer needs, showcasing strong problem-solving skills and the ability to work independently.

Benefits include year-end bonuses and support for continuous growth and development.