Vacancy Description
**Job Description Summary**
The Dicing/Grinding Technician is responsible for executing and continuously improving wafer dicing and grinding processes. This role requires strong technical judgment, advanced troubleshooting skills, and the ability to work with minimal supervision. The technician will collaborate closely with engineering, manufacturing, and management teams to support production, new product introductions, and process optimization initiatives.
**Job Description**
**Key Responsibilities**
**Process Execution & Improvement**
+ Drive continuous improvement in dicing and grinding processes to enhance performance, yield, and reliability.
+ Construct, evaluate, and refine complex engineering models using conceptual inputs and technical judgment.
+ Identify process gaps and proactively recommend and implement corrective actions.
**Troubleshooting & Root Cause Analysis**
+ Anticipate issues and perform advanced troub...
The Dicing/Grinding Technician is responsible for executing and continuously improving wafer dicing and grinding processes. This role requires strong technical judgment, advanced troubleshooting skills, and the ability to work with minimal supervision. The technician will collaborate closely with engineering, manufacturing, and management teams to support production, new product introductions, and process optimization initiatives.
**Job Description**
**Key Responsibilities**
**Process Execution & Improvement**
+ Drive continuous improvement in dicing and grinding processes to enhance performance, yield, and reliability.
+ Construct, evaluate, and refine complex engineering models using conceptual inputs and technical judgment.
+ Identify process gaps and proactively recommend and implement corrective actions.
**Troubleshooting & Root Cause Analysis**
+ Anticipate issues and perform advanced troub...
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